إيجاد طرائق جديدة في تلبيس بعض أنواع البلاستيك بالمعادن

الموضوعات

علوم بحتة وطبيعية

روابط وملفات

التعريف والنوع

رقم الوثيقة

fdb0dcad-ae61-41a9-8284-84b655229754

رقم العقد

0

نوع الوسائط

Crawler

نوع المحتوى

الرسائل العلمية

صيغة المصدر

رسائل ماجيستير

نوع الملف

pdf text

أسماء الملفات

1961615_1.pdf

بيانات النشر

ترجمة العنوان

Finding New Ways in Plating some Kinds of Plastic with Metals

ألقاب المؤلفين

[{"name_ar":"أحمد شيخه","title_ar":"اعداد","title_en":"Preparation"},{"name_ar":"عبدالله وتى","title_ar":"اشراف","title_en":"Supervision"},{"name_ar":"محمد السمعو النجار","title_ar":"اشراف","title_en":"Supervision"}]

اللغة

Arabic

المصدر والدورية

اسم المصدر

إيجاد طرائق جديدة في تلبيس بعض أنواع البلاستيك بالمعادن

المحتوى والصفحات

عدد الصفحات

0

ترجمة الملخص

In this research a new method palladium-free, chromium free, environmentally friendlyand low cost process for plating on ABS and PP plastics was studied. Immobilizing Cu carried out the activation as catalyst sit on the ABS and PPplastics Firstthe samples was achieved for studiedPreparation includedinsuranceand cleaninga surface of substrates, after then etched bytwodeferentmethods:(CrO3+H2SO4) mixturefor different of relations of mixtureand times and temperatures.(H2O2+H2SO4)mixturefor different of relations of mixtureand times and temperatures.The ABS and PP plastics of the etched have activated by two deferent methods:The activation of surface by metal palladiumPd.The activation of surface by metal copper Cu that depend onchitosan complex.Then activation then plated by Cu and Ni electroless plating baths then plated by Cu, Niand Cr electroplating baths.The surface ofABS andPP foils after etching were studiedby the photographicmicroscopy. After then the surface of ABS and PP foils after etching and activation were studied by X-rays diffraction (XRD) and FT-IR Spectroscopy. Finally measure deposition for Cuand Ni electroless and Cu, Ni and Crplating layers on surface of ABS and PP plasticswere studied according Standard TestMethods for Measuring Adhesion (ASTM-D3359), and thicknesswas determinedfor Cu, Ni, and Cr plating layers on ABS and PP plastics surface by microscopy Al wirashi set.The etching by (H2O2+H2SO4)mixturebetter than (CrO3+H2SO4) mixture.in electroless plating on ABS and PP plastics.Particles were uniformly formed on the substratesand a glossy smooth, and showed that Cu, Ni plating layers on surface ofABS andPPplasticsare amorphous. (ASTM-D3359) showed that Cu and Ni plating layers are very strong.

إشراف وإعداد

الإشراف

عبدالله وتى, محمد السمعو النجار

الإعداد

أحمد شيخه

الاقتباسات الببليوغرافية